发明名称 METHOD AND APPARATUS FOR BONDING SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To accurately perform thermocompression bonding, without causing positional deviation between the upper and the lower substrates by using a press member on which a cushioning material is bonded. SOLUTION: Thermocompression bonding of a plurality of jointed substrates 6, in which substrates 10 and 11 are provisionally pressed in a provisional press station 2, is conducted a plurality of stages among press stages 40a to 40d and 41a to 41d which constitute a hot-press station 3. Since the cushioning material 64 and 65 is pressurized directly in contact with the substrates 10 and 11 at each press stage, a deviation is produced between both substrates 10 and 11, caused by distortion or the like during the pressurization of the cushioning materials 64 and 65. Then, the deviations to be produced at the hot-press station 3 is anticipated in advance, at aligning of the upper and lower substrates 10 and 11 conducted at the provisional press station 2, and positioning is performed, in a state with both the substrates 10 and 11 being in offset state.
申请公布号 JP2002229043(A) 申请公布日期 2002.08.14
申请号 JP20010276632 申请日期 2001.09.12
申请人 HITACHI ELECTRONICS ENG CO LTD 发明人 WATANABE HIROYUKI;OTSUBO YUJI;SUGIZAKI SHINJI;ICHIKAWA HISAYOSHI;KIYOMIYA HIROAKI
分类号 G02F1/1339;G02F1/1333;G09F9/00;(IPC1-7):G02F1/133;G02F1/133 主分类号 G02F1/1339
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