| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a circuit part that can transfer a solder paste to a pattern with good precision even if there is difference in length between the pattern of a substrate and an orifice of a mask. SOLUTION: The method is provided with a process wherein a pattern 3 formed in a substrate 1 and the orifice formed in the mask are imaged, a process wherein the difference in length along specific direction between the pattern and the orifice is measured from an imaging signal in the imaged pattern and orifice, a process wherein the substrate and the mask is positioned at specific intervals, separating and facing each other, by making the end of the specific direction in the pattern accord with the end of the specific direction in the orifice, and a process wherein the solder paste is printed on the pattern in the substrate by shifting a squeegee from one end of the specific direction to the other end of the specific direction, adjusting a relative position along the specific direction in the substrate and the mask according to the travel distance of the squeegee and the difference in length between the pattern and the orifice. |
