发明名称 HEAT TREATMENT DEVICE
摘要 PROBLEM TO BE SOLVED: To cause a cover body temperature to rapidly follow a hot plate temperature and further rapidly stabilize when the hot plate temperature is varied. SOLUTION: A heat pipe 62 is incorporated in a cover body upper part 60a. The heat pipe 62 is situated in a state that a part thereof is extended to the side of a cover body 60 and a Peltier element 64 is situated at the tip of an extension part 62c described above. The Peltier element 64 is provided with a temperature control device 67 to control ON and OFF of the Peltier element 64 based on the value of a temperature sensor 66 to detect the temperature of the cover body 60. When a hot plate temperature is varied from a high temperature to a low temperature, the Peltier element 64 is operated and cooling operation of the cover body 60 is promoted through the heat pipe 62. When the cover body 60 reaches a given stable temperature, the Peltier element 64 is switched to OFF and cooling operation of the heat pipe 62 is stopped. This constitution causes a cover body temperature to rapidly follow the hot plate temperature and be further rapidly stabilized.
申请公布号 JP2002228375(A) 申请公布日期 2002.08.14
申请号 JP20010018826 申请日期 2001.01.26
申请人 TOKYO ELECTRON LTD 发明人 ASAKA KOICHI;SEKIMOTO EIICHI;TAGAMI MITSUHIRO
分类号 G03F7/38;F28D15/02;H01L21/027;(IPC1-7):F28D15/02 主分类号 G03F7/38
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