| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor test socket using a POGOPIN contact. SOLUTION: The test socket 26 comprises a body for accepting a semiconductor device having a plurality of pins 30. The body has an integrally formed guide post 50, an impact base 39 with its corner removed and a floating base disposed in the body. The floating base comes into contact with the semiconductor device and decreases an unnecessary pressure applied to the plurality of pins 30 by giving movement to the semiconductor device. The test socket 26 further comprises a plurality of POGOPINs located adjacent to one another, each including a cylindrical chamber 38 and a plunger 42 having crowns 44 at both ends, and a rear sheet removably attached to the body. One end of the plunger 42 directly contacts the pins 30 of the semiconductor device, and the other end contacts an external test apparatus.
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