| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermosetting resin composition which has excellent flame retardancy without deteriorating adhesion and other characteristics, and to provide a laminate which uses the thermosetting resin composition and is used for circuit boards. SOLUTION: This thermosetting resin composition is characterized by containing as essential components one compound selected from compounds having structures represented by formula (1) and a thermosetting resin which has two or more dihydro-1,3-benzoxazine rings in one molecule and a weight- average pts.wt. of <=1,000.
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