发明名称 METHOD FOR DRIVING THERMAL INSULATING MATERIAL, ETC., INTO PERFORATED PC BOARD
摘要 PROBLEM TO BE SOLVED: To provide a method for driving a thermal insulating material, etc., into a perforated PC board by which there exists no possibility of decreasing thermal insulation and sound absorbing effects and appearance of a product. SOLUTION: When the perforated PC board A manufactured as a pre- tensioning prestressed material is to be manufactured by placing a concrete on a long line bed 1 in a continuous length and the thermal insulating material and a sound absorbing material 4 is to be placed, by placing the thermal insulating material and the sound absorbing material 4 on the long line bed 1 before the concrete is placed and holding the surroundings of the placed thermal insulating material and the sound absorbing material 4 with a joint compound 5 fixed and arranged on the long line bed 1, the thermal insulating material and the sound absorbing material 4 and prevented from being moved when the concrete is placed and concrete ingredients and cutting water containing cuttings when cutting is performed are prevented from creeping to the surfaces of the thermal insulating material and the sound absorbing material 4.
申请公布号 JP2002225023(A) 申请公布日期 2002.08.14
申请号 JP20010022930 申请日期 2001.01.31
申请人 TSURUGA SUPANKURIITO KK 发明人 YATANI TAKESHI
分类号 B28B1/16;B28B23/06;(IPC1-7):B28B23/06 主分类号 B28B1/16
代理机构 代理人
主权项
地址