发明名称 |
POWER MODULE |
摘要 |
In a power module which incorporates a switching semiconductor element and a smoothing capacitor and includes a metallic base plate capable of dissipating heat produced by the switching semiconductor element and the smoothing capacitor, the metallic base plate is thermally separated into a first region adjacent to the switching semiconductor element and a second region adjacent to the smoothing capacitor. <IMAGE> |
申请公布号 |
EP1231639(A1) |
申请公布日期 |
2002.08.14 |
申请号 |
EP20000953492 |
申请日期 |
2000.08.18 |
申请人 |
MITSUBISHI DENKI KABUSHIKI KAISHA |
发明人 |
YOSHIMATSU, NAOKI;NAKAJIMA, DAI |
分类号 |
H01L23/13;H01L23/24;H01L25/16 |
主分类号 |
H01L23/13 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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