ADHESIVE COMPOSITION FOR ELECTRONIC MATERIAL

摘要

PURPOSE: Provided are an adhesive composition for electronic material, which improves heat resistance between cupper foil and polyimide, polyester film, and so on which are used as basic film in FPC(flexible print circuit), and which can show adhesion at relatively low temperature. CONSTITUTION: The adhesive composition contains an acryl rubber having weight average molecular weight of 10,000-1,000,000 and hydroxyl value(KOHmg/g) of 2-50; an epoxy resin having at least two epoxy groups and comprising 20-50 wt% of bromine; and a hardener having ester group. The hardener having ester group is obtained by reacting an acid anhydride and alcohols, and further reacting the reactant with dichloride compound. The epoxy resin is used in composition range of epoxy resin/acryl rubber(weight ratio) of 2/8-8/2.