RESIN COMPOSITION AND METHOD FOR THERMOSETTING USING THE SAME

摘要

PROBLEM TO BE SOLVED: To obtain a resin composition having excellent surface curability during curing and capable of forming a molded product having excellent chemical resistance even without surface sealing of a Mylar (R) film during thermosetting and to provide a method for thermosetting using the resin composition. SOLUTION: This resin composition comprises (a) an unsaturated polyester with a weight ratio of 20-45 wt.% of dicyclopentenyl group, (b) a compound having an acryloyl or a methacryloyl group and (c) an aromatic monomer without the acryloyl or methacryloyl group and the contents thereof are 30-80 wt.% of (a), 3-30 wt.% of (b) and 5-60 wt.% of (c).