| 摘要 |
A method of manufacturing an electronic structure, which structure comprises a first power device (1) and a second unidirectional device (120), both integrated in the same protective package; the first device (1) having at least first and second electrodes (8,9) of the first device (1), with said first electrode (8) of the first device (1) being attached to the package; and the second device (120) having first and second electrodes (170,160) of the second device (120); wherein the first electrode (170) of the second device (120) is superposed on the second electrode (9) of the first device (1) and connected electrically to the second electrode (9) of the first device (1). <IMAGE> |
