发明名称 |
BEVELING WHEEL FOR MACHINING OUTER CIRCUMFERENTIAL PART OF SILICONE WAFER, AND METHOD FOR MANUFACTURING THE SAME |
摘要 |
PURPOSE: To provide conductivity to adhesive agent for fixing an abrasive grain layer, employ a base metal of light metal or light metal alloy, and reduce weight of a beveling wheel in the beveling wheel for machining an outer circumferential part of a silicone wafer in which the abrasive grain layer provided with one or plural grooves are formed is fixed to an outer circumferential part of the base metal. CONSTITUTION: The abrasive grain layer 2a in a circular form is manufactured comprising metal bond or conductive resin bond as binder using a die, the abrasive grain layer 2a is fixed to the outer circumferential part of the base metal 1 of aluminum or aluminum alloy through the adhesive agent 4 having conductivity, and one or plural grooves 3 are formed in the abrasive grain layer 2a by electric discharge machining to be the beveling wheel 10.
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申请公布号 |
KR20020065838(A) |
申请公布日期 |
2002.08.14 |
申请号 |
KR20020004463 |
申请日期 |
2002.01.25 |
申请人 |
NORITAKE CO., LIMITED |
发明人 |
KAWASAKI KAZUYOSHI;TANAKA YOSHIHIRO |
分类号 |
B24D3/00;B24D3/34;B24D5/00;H01L21/304;(IPC1-7):H01L21/304 |
主分类号 |
B24D3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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