| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition which has high heat resistance, low dielectric constant, excellent adhesiveness and excellent flame retardancy, and is also suitable for a printed wiring board. SOLUTION: This heat resistant resin composition contains as an essential component (A) a benzocyclobutene resin or its prepolymer represented by the formula. [wherein, R represents an alkyl group, an aryl group, -O-, Si(CH3)2-, -SO2- or -S-, or combination of these], (B) an epoxy modified polybutadiene resin, and (C) an aromatic amine compound containing one or more halogen atoms in one molecule.
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