| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition having good thixotropy. SOLUTION: The epoxy resin composition includes (A) component: an epoxy resin, (B) component: an epoxy curing agent, (C) component: a fine powder silica compound, and (D) component: one or more compounds selected from a group consisting of a carboxylic acid, a zinc carboxylate and a lead carboxylate. The (D) component preferably comprises an 8-30C higher fatty acid, a zinc salt of the higher fatty acid, and/or a lead salt of the higher fatty acid, and more preferably stearic acid, zinc stearate and/or lead stearate. A formulation ratio of the components (A) to (D) is preferably [(A) component + (B) component]:[(C) component]:[(D) component]=[100]:[0.1-15]:[0.05-10], in a mass ratio. The epoxy resin composition can be used suitably as an adhesive, a filler, a joint agent, an impregnating agent or the like.
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