| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for a semiconductor sealing material excellent in low warpage, crack resistance and electrical properties for use in sealing a package of such a type as to hold semiconductor chips such as ball grid arrays on a resin substrate, to provide a cured product of the above composition, and to provide a semiconductor device using the above cured product. SOLUTION: This epoxy resin composition is characterized by comprising a curing promoter, an epoxy resin and a curing agent; wherein a phosphine oxide compound is the essential component for the curing promoter, the epoxy resin includes 5-100 wt.% of an epoxy resin of general formula (2), and the curing agent is a bifunctional or higher functional ester-containing compound or ester-containing resin where 10-100 mol% of the hydroxy groups are esterified with aromatic acyl groups.
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