| 摘要 |
PROBLEM TO BE SOLVED: To prevent solder separation, a scratch, deformation, displacement and the like of an electrode lead caused by the horizontal movement of a stopping claw for crimping the electrode lead of a measured semiconductor device to a wiring pattern on a printed wiring board connected to a tester. SOLUTION: A plate cam 12 and a cam follower 14 are previously formed so that when a stopping mechanism having the stopping claws 5 each having rotatable one end and a tip abutting on the electrode lead 24 of the semiconductor device 1 is moved downward, the movement amount in horizontally moving the tip of the stopping claw 5 is so geared with the downward movement as to move the stopping mechanism itself in the direction opposite to the moving direction. Thereby, the horizontal movement amount of the tip of each stopping claw 5 is compensated.
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