| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing an inexpensive package for optical communication having good operability. SOLUTION: A method for manufacturing a package 10 for optical communication which forms a through hole 18 communicated with a cavity 12 at the side part of a base body 11 made of ceramics in which the cavity 12 for mounting a semiconductor device for optical communication is formed in the inside, and cements a metal fixing member 20 provided with a translucent member 24 for placing oppositely to the tip part of an optical fiber 25 in a through hole 23 to the peripheral edge of the through hole 18, has a process for dividing the metal fixing member 20 into a flange 21 cemented to the peripheral edge of the through hole 18 and a holder 22 to cement and hold the translucent member 24 a process for cementing the flange 21 to the peripheral edge of the through hole 18 through a high temperature brazing filler metal, a process for grinding the tip part of the flange 21 vertically on the basis of the bottom surface 26 of the base body 11, a process for cementing the translucent member 24 to the holder 22, and a process for cementing the holder 22 to the flange 21 through a low temperature brazing filler metal.
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