发明名称 Verfahren zur Herstellung von Si-Al Legierungen zur Verpackung von electronischen Bauteilen
摘要 A method of producing a silicon based alloy is described which comprises melting a silicon alloy containing greater than 50 wt. % silicon and preferably including aluminium. The melted alloy is then inert gas atomized to produce powder or a spray formed deposit in which the silicon forms a substantially continuous phase made up of fine, randomly oriented crystals in the microstructure. The alloy produced by the method has particularly useful application in electronics packaging materials and a typical example comprises an alloy of 70 wt. % silicon and 30 wt. % aluminium. Such an alloy is an engineering material which, for example, is machinable.
申请公布号 DE69615375(T2) 申请公布日期 2002.08.14
申请号 DE1996615375T 申请日期 1996.07.18
申请人 OSPREY METALS LTD., NEATH 发明人 LEATHAM, GEORGE;OGILVY, JOSEF;ELIAS, LUIS
分类号 B22D23/00;B22F3/115;B22F9/08;C22C1/04;C22C1/10;C22C25/00;C22C28/00;C22C32/00;H01L23/06;H01L23/14;H01L23/373;(IPC1-7):B22D23/00;H01L23/36 主分类号 B22D23/00
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