| 摘要 |
A power-coupling pad (160 or 170) is located on a lateral edge portion of an electronics module (100). Each power-coupling pad (160, 170) is mated with a power supply clip (240, 250) which is included within a side of a card guide that supports and retains the electronics module (100). The power supply clip (240, 250) can incorporate a spring which provides constant and affirmative contact with the power-coupling pad (160, 170) through a low resistance path. The power-coupling pad (160, 170) and power supply clip (240, 250) can be constructed using any suitable conductive material such as gold, nickel, lead, chromium and palladium.
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