| 发明名称 |
Forming electrical/mechincal connections |
| 摘要 |
<p>A pin contact to a substrate is formed by subjecting a metallic ball formed at the end of a wire 10 to compression and thermosonic vibration using a capillary bonding tool 12. The ball is extruded into the capillary and subsequently the wire is separated from the extruded portion to form the pin 20.</p> |
| 申请公布号 |
GB2362035(B) |
申请公布日期 |
2002.08.14 |
| 申请号 |
GB20000028595 |
申请日期 |
2000.11.23 |
| 申请人 |
* PIXELFUSION LIMITED;* CLEARSPEED TECHNOLOGY LIMITED;ELWYN PAUL MICHAEL * WAKEFIELD |
发明人 |
ELWYN PAUL MICHAEL * WAKEFIELD |
| 分类号 |
H01L21/48;H01L21/60;H05K3/40;(IPC1-7):H01L21/607;B23K20/00;H05K3/32 |
主分类号 |
H01L21/48 |
| 代理机构 |
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代理人 |
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| 主权项 |
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