ADVANCED FLIP-CHIP JOIN PACKAGE

摘要

The present invention provides a method of attaching an integrated circuit die to a substrate. The method includes applying solder bumps to contact areas, and placing the inverted integrated circuit die in a desired location such that the solder bumps are in contact with contact areas of the integrated circuit die and the substrate. The solder bumps are heated to mount the die, such that the bumps form a connection between the substrate and the integrated circuit. The gap between the die and the substrate is underfilled by injecting a molding compound into a molding die positioned over the mounted integrated circuit die.