Out-of-plane micro-device structures

摘要

Several methods and structures for improving the yield of out-of-plane micro-device structures including springs and coils (31,32) are described. In one method the elastic members have graded perforations for controlling rate of release. In another method and structure, a layout enables the contact landing area to be increased. To form the coils opposite ends of the sprigs (31,32) are provided with inter-engaging formations (33,34) to facilitate their interconnection. The high yield structures may be used in numerous electronic applications such as filter circuits. <IMAGE>