| 摘要 |
PURPOSE: A structure of a leadframe for fabricating a semiconductor package is provided to reduce the generation of burr and abrasion of a blade, by designing a half-etched Y-typed tie bar in a corner portion of the package in which sawing lines cross each other. CONSTITUTION: The leadframe(1) has a plurality of sub-pages. A supporting bus bar(5) is formed on the sub-pages. A lead(4) is extended from the supporting bus bar. A semiconductor chip is settled in a die pad(3). The tie bar(2) is connected to the corner portion. Units having the supporting bus bar, the lead, the die pad and the tie bar are disposed as an array type. The tie bars of the respective units are of a Y type.
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