| 摘要 |
A circuit for altering a chip pad signal incorporates a primary driver that is configured to deliver a chip pad signal to an IC package. The circuit also is configured to cooperate with a second signal and a third signal, with the second signal having a voltage higher than the voltage of the first logic high, and the third signal having a voltage lower than the voltage of the first logic low. So configured, the primary driver may selectively deliver a second logic high, which has a voltage higher than the voltage of the first logic high, to the IC package, and may selectively deliver a second logic low, which has a voltage lower than the voltage of the first logic low, to the IC package. Electronic devices, systems and methods also are provided.
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