| 摘要 |
During device design, wire bonds are typically considered lumped electrical parasitic elements. To minimize their effect, designs attempt to reduced their length. In the invention, wire bonds are considered as transmission lines and their spacing and configuration on the device planned accordingly. Specifically, bond wires are treated as "coplanar wires." By selecting a proper combination on wire diameter, bond wire spacing, separation of the bond wires from the substrate and the substrate dielectric constant, a desired bond wire impedance is achievable.
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