发明名称 DIE-BONDING UNIT
摘要 PURPOSE:To reduce the number of manufacturing steps and to improve the rate of yield by a method wherein an adhesive agent thermosetting mechanism is additionally provided capable of transporting a lead frame after pellet mounting. CONSTITUTION:A lead frame handling section 9, after detecting the completion of pellet mounting onto a paste-applied lead frame 14, handles the lead frame 14 into a stage 8. The lead frame 14 synchronized with a feeding section 11 is sent into a heater unit 3, heated while travelling along a heater block 10, and accommodated in a housing section 12. When the index time per pellet in the heating unit 3 is not longer than that in a die-bonder 1, the intermediate stage 8 keeps the die-bonder 1 and the heating unit 3 from mutual interference. This in turn enables a fine trimming of heating time, preventing die-bonder serviceability deterioration that may otherwise be present due to improper line balancing.
申请公布号 JPS5834933(A) 申请公布日期 1983.03.01
申请号 JP19810133504 申请日期 1981.08.26
申请人 NIPPON DENKI KK 发明人 TAKABAYASHI SATOSHI
分类号 H01L21/52;H01L21/58;(IPC1-7):01L21/58 主分类号 H01L21/52
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