| 摘要 |
A semiconductor device comprising: a resin sealing body, plural semiconductor chips situated inside the resin sealing body and formed of rectangular-shaped plane surfaces, having a first main surface and second main surface facing each other, and having electrodes disposed on the first side of a first side and a second side of the first main surface, the first side and second side facing each other, and leads having inner parts situated inside the resin sealing body and outer parts situated outside the resin sealing body, the inner parts being electrically connected to the electrodes of the plural semiconductor chips via bonding wires, wherein: the first main surfaces are aligned in the same direction with their respective first sides situated on the same side, and the plural semiconductor chips are laminated in positions offset with respect to one another such that the electrodes of one of the mutually opposite semiconductor chips are situated further outside than the first sides of the other semiconductor chips.
|
