SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A semiconductor package is provided to emit efficiently heat generating from a semiconductor chip by using a heat slug. CONSTITUTION: A semiconductor chip(30) is adhered on a chip loading region of a printed circuit board(10) by using an adhering member(40). A bonding pad of the semiconductor chip(30) is boned with a conductive pattern of the printed circuit board(10) by a wire(32). A lower end portion of a leg portion(16) of a heat slug(12) is mounted on a ground layer(26) exposed on the printed circuit board(10). A bottom portion of a body portion(14) of the heat slug(12) is closely approached to an upper surface of the semiconductor chip(30). A rectangular projection portion(20a) and the bottom portion of the body portion(14) of the heat slug(12) are formed with one body. A resin(34) is molded on the printed circuit board(10) including the semiconductor chip(30) and the wire(32).