发明名称 Method for fabricating piezoelectric/electrostrictive thick film using seeding layer
摘要 Disclosed is a method for fabricating a piezoelectric/electrostrictive thick film, using a seeding layer. On a substrate is formed the seeding layer which is prepared from a ceramic sol solution or a ceramic paste, both identical or similar in composition to the piezoelectric/electrostrictive film. The ceramic paste is prepared from a mixture of a ceramic oxide powder, which has a particle size of 5 mum or less and is prepared from Pb and Ti-based piezoelectric/electrostrictive elements by a non-explosive oxidation-reduction combustion reaction at 100-500° C., and a ceramic sol solution in water or an organic solvent, identical or similar in composition to the ceramic oxide powder. Then, the seeding layer is subjected to an after-treatment. A piezoelectric/electrostrictive film is directly formed on the seeding layer. Alternatively, a piezoelectric/electrostrictive film, separately formed and sintered, is attached on the seeding layer.
申请公布号 US6432238(B1) 申请公布日期 2002.08.13
申请号 US19990330557 申请日期 1999.06.11
申请人 SAMSUNG ELECTRO-MECHANICALS CO., LTD. 发明人 YUN SANG KYEONG;KIM DONG-HOON
分类号 H01L41/22;H01L41/24;(IPC1-7):B32B31/26;C04B35/622 主分类号 H01L41/22
代理机构 代理人
主权项
地址