发明名称 Method of fabricating semiconductor device
摘要 A semiconductor device having a bottom electrode, a ferroelectric film, and a top electrode formed on a semiconductor substrate, wherein the angle of each of the main cross sectional sides of the ferroelectric film relative to the main surface of the semiconductor substrate is less than 75 degrees. Forming the ferroelectric film into the trapezoid in cross section having such an angle provides a microscopic capacitor without electrical short-circuit between the top and bottom electrodes if the top electrode, the ferroelectric film, and the bottom electrode are etched with single photolithography process step. The novel technique implements a microscopic memory cell structure suitable for highly integrated memory devices.
申请公布号 US6432767(B2) 申请公布日期 2002.08.13
申请号 US20010897615 申请日期 2001.07.03
申请人 HITACHI, LTD. 发明人 TORII KAZUYOSHI;KAWAKAMI HIROSHI;MIKI HIROSHI;KUSHIDA KEIKO;FUJISAKI YOSHIHISA;MONIWA MASAHIRO
分类号 H01L21/02;H01L21/8242;(IPC1-7):H01L21/824 主分类号 H01L21/02
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