METHOD FOR FABRICATING SEMICONDUCTOR CHIP

摘要

PURPOSE: A method for fabricating a semiconductor chip is provided to prevent chipping and cracks by weakening physical force of grinding devices to each chip. CONSTITUTION: A boundary slot is formed by cutting a boundary between chips(2) formed on a semiconductor wafer. A protective tape is adhered on a surface of the semiconductor wafer. A back grinding process for a back face of the semiconductor wafer including the boundary slot is performed. An expanding tape(32) is adhered on a back face of the semiconductor wafer. The protective tape is removed. The chips are separated by expanding both sides of the expanding tape(32). The expanding tape(32) is expanded by drawing bars(34) adhered on both ends of the expanding tape(32).