| 摘要 |
A plurality of pressure sensor dice are attached to an array of pressure sensor die attach sites located on a custom substrate having holes. The pressure sensor dice are then electrically connected to the pressure sensor die attach sites using standard flip chip techniques.The resulting array of pressure sensor sub-assemblies is then molded, so that a cavity is formed that is open at the bottom of each hole in the custom substrate. A portion of the outer surface of the micro-machine element of each pressure sensor die is left exposed at the bottom of the hole in the substrate. After molding, the exposed outer surface of the micro-machine element is covered with a pressure coupling gel applied in the hole. The resulting array of packaged pressure sensors are then sigulated using well know sawing or laser techniques or by snapping a specially formed snap array.
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