发明名称 LASER CUTTING METHOD, ELECTROOPTIC DEVICE MANUFACTURING METHOD, OPTOELECTRONIC DEVICE AND ELECTRONIC APPARATUS
摘要 <p>PROBLEM TO BE SOLVED: To provide a laser cutting method capable of efficiently cutting a panel-like work such as a glass substrate used for a liquid crystal panel with high accuracy, an optoelectronic device manufacturing method utilizing the laser cutting method, an optoelectronic device, and an electronic apparatus. SOLUTION: In manufacturing the optoelectronic device, a large panel 300 formed by overlapping and affixing two large substrates 100 and 200 is cut into strip-like panels by irradiating laser beams L1 and L2 on both a face side and a back side of the large panel. Heat converging patterns 45 and 55 are formed along a cutting line 301 in the large substrates 100 and 200. Since the heat converging patterns 45 and 55 are highly heat-conductive, and when the laser beam is irradiated toward the heat converging patterns 45 and 55, the large panel 300 can be cut along the cutting line 301 with excellent accuracy.</p>
申请公布号 JP2002224870(A) 申请公布日期 2002.08.13
申请号 JP20010023345 申请日期 2001.01.31
申请人 SEIKO EPSON CORP 发明人 TAKEI ATSUSHI
分类号 G02F1/1333;B23K26/00;B23K26/40;B23K101/36;C03B33/07;C03B33/09;G09F9/00;(IPC1-7):B23K26/00;G02F1/133 主分类号 G02F1/1333
代理机构 代理人
主权项
地址