| 摘要 |
The invention relates to a configuration for reducing the number of pads on a semiconductor chip (1) with an integrated circuit. This configuration includes an analog/digital converter (3), which feeds internal voltages that are delivered by different locations (2) in the integrated circuit via a pad (9) to a fuse cutter (5), which then blows fuses (7) in order to bring the measured internal voltages into accord with target values.
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