Method for improved passive thermal flow in silicon on insulator devices

摘要

Increased heat dissipation is provided in a high performance integrated circuit by providing a thermally conductive path from a thermal poly plug (TPP) which extends through a thermal barrier in the substrate, such as in insulator layer of a silicon-on-insulator layer, to a front surface of the chip simultaneously with formation of active device contacts through an insulator layer of said chip. A pad is formed in thermal contact with said thermally conductive path simultaneously and coplanar with wiring connections to active device contacts and a further thermally conductive path may be formed through wiring and/or further insulator layers to a pad for attachment of a passive heat sink or active cooling device coplanar with wire bond pads at a surface of the wiring and/or further insulator layers. Electrical connections to the wire bond pads are formed through optionally insulated apertures in the passive heat sink or active cooling device. Enhancements to heat transfer are provided by removing insulator at the bottom of the YPP and simultaneous formation with portions of active devices.