| 摘要 |
PROBLEM TO BE SOLVED: To obtain a resin composition capable of using for contact members of a semiconductor device, having heat resistance useful for fixing inner lead wire by including a copolymer obtained by reacting a tetracarboxylic acid dianhydride and diamine or the like and a specific polyether. SOLUTION: This resin composition is obtained by including the copolymer obtained by reacting (A) the tetracarboxylic acid dianhydride, (B) the diamine (e.g.; 1,2-diaminopropane or the like) or diisocyanate and (C) the polyether of formula R-Q1-O-(Q2-O-)p-Q3-R (Q1 to Q3 are each an 1-10C alkylene; R is OH or COOH; p is 0 to 100). The preferable amount of the component C in weight is 30 to 70% to the sum of component A, B and C. The component A including at least 50% of bisphenol A bistrimellitate dianhydride based on the gross of the component A is preferred. |
