| 摘要 |
PROBLEM TO BE SOLVED: To provide a compound processor which can made small in its size and be manufactured inexpensively. SOLUTION: This processor includes a transferring device 10, a plurality of process devices 30, 40, 50 linked to the transportation device 10, controllers 13, 33, 43, 53 for controlling the process devices, a load lock chamber 21 and an unload lock chamber 22 linked to the transportation device 10, an atmosphere transportation device, and a load cassette. The atmosphere transportation device feeds a semiconductor wafer to be processed from its load cassette into the load lock chamber 21 and transports the processed semiconductor wafer from the unload lock chamber 22 into its load cassette. |
