| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a small semiconductor package which is enhanced in reliability by a method wherein the semiconductor package is kept free from cracks by relaxing the inner pressure due to steam generated in reflow taking advantage of a through-hole. SOLUTION: An opening 3 and a through-hole 9 are provided to a polyimide bonding sheet 1. A copper foil is stuck, and then an inner connection part and an expansion wiring 2 are formed. A frame is punched out of the sheeting, and openings which are made to serve as inner connection sections, expansion wirings, and outer connection sections are provided to the frame to make it serve as a support board (a). A die bond film is attached to the rear side of a wafer 6, and the wafer 6 is diced into die bond material-attached chips as prescribed in dimensions (b). The die bond material- attached chips 6 are bonded to the semiconductor chip mounting region of the insulating support board, the electrode of the semiconductor chip is electrically connected to the inner connection section (c), the insulating support board mounted with the semiconductor chips 6 is put in a transfer molding die and sealed up with semiconductor sealing epoxy resin (d), a solder ball is arranged at each opening which serves as an outer connecting section and melted (e), and then the supporting board is divided into unit semiconductor packages by punching (f). |
