METHOD AND APPARATUS FOR SOLDERING FILM TYPE ELECTRONIC COMPONENT

摘要

PURPOSE: A method and an apparatus for soldering a film type electronic component are provided to improve productivity by welding simultaneously each terminal of a circuit board with each lead terminal of a film type electronic component. CONSTITUTION: A solder paste is printed on a terminal having a predetermined pattern of a circuit board(100). A film type electronic component(200) such as a lead terminal(201) of TAB LSI(Tape Automated Bonding Large Scale Integration) is welded into the terminal of the circuit board(100) printed with the solder paste. The circuit board(100) is loaded on a loading portion of a base plate member(11). An absorbing pad(21) is formed on the base plate member(11) in order to absorb the circuit board(100). An injection nozzle(31) is used for injecting hot wind to the terminal of the circuit board(100) and the lead terminal(201). A hot wind generation portion is connected with the injection nozzle(31).