发明名称 |
METHOD FOR INSULATING COMPONENTS OF SEMICONDUCTOR DEVICES BY MEANS OF GROOVES |
摘要 |
semiconductor engineering. SUBSTANCE: two types of oxide films are used for the purpose. Groove in semiconductor substrate is filled with multilayer film of two alternately applied oxide films having different stress characteristics. Composite oxide film filling the grooves is compacted. Then it is leveled off until upper surface of stencil layer is exposed. In this way groove filling layer is obtained. EFFECT: reduced stresses in vicinity of substrate insulation; enhanced degree of device integration. 17 cl, 7 dwg, 1 tbl
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申请公布号 |
RU2187174(C2) |
申请公布日期 |
2002.08.10 |
申请号 |
RU19970121905 |
申请日期 |
1997.12.30 |
申请人 |
SAMSUNG EHLEKTRONIKS KO., LTD. |
发明人 |
PARK MUN-KHAN;KHONG SUG-KHUN;SIN JU-GJUN |
分类号 |
H01L21/76;H01L21/762;(IPC1-7):H01L21/762 |
主分类号 |
H01L21/76 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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