| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer wiring board, with which an electric characteristic between an electronic component integrally included in a substrate and an IC chip or the like mounted on a first main surface, and the electronic component and the IC chip can be normally operated at high speed. SOLUTION: This multilayer wiring board 1 include a substrate 2 having insulating layers 3, 4, 5 and wiring layers 6, 7, which are alternately laminated, a front surface 4a and a rear surface 5a, a throughhole 8, which penetrates between the front surface 4a and the rear surface 5a of this substrate 2, a chip capacitor (electronic component) 10 filled in the throughhole 8 via an embedded resin 9, and built-up layers BU1, BU2, which are formed above the front and rear surfaces 4a, 5a of the substrate 2 and include resin insulating layers 18, 24, 19, 25 and wiring layers 22, 23. An electrode 11 of the chip capacitor 10 and the wiring layer 16 are connected in the front surface 4a (front surface 9c of the resin insulating layer 9). A solder bump (terminal) 28 protruded higher than a first main surface 26 is formed on the wiring layer 22. |
