| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device that can be manufactured at a low cost and can be miniaturized easily, and to provide a manufacturing method of the semiconductor device. SOLUTION: A wire 23 such as a gold wire is connected to a plurality of pads 22 on the surface of a semiconductor chip 21 by wire bonding so that the wire 23 is vertical to the chip surface. The surface of the semiconductor chip 21 and the periphery of the wire 23 are covered with thin resin layers 24a and 24b, respectively. The upper end face of a coaxial body consisting of the wire 23 and the resin layer 24b for covering the wire 23 is polished or cut so that it is flat, and the wire 23 is exposed on the upper face of the coaxial body. A solder ball 26 is fixed onto the upper face of the coaxial body so that the solder ball 26 contacts the upper end of the wire 23, the gap between the solder ball 26 and the coaxial body is filled with resin 25, and junction to the wire 23 of the solder ball 26 is reinforced by the resin 25. The resin 25 is contained in the flux for mounting the solder ball 26, a flux is lost by reflow, and only the resin remains around the solder ball 26 and formed. |
