| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor package and a semiconductor device which can be easily laminated on a board in a comparatively simple structure and effectively radiate heat stored in die pads underlying the package, thereby enabling the mounting at a high reliability and high density. SOLUTION: The semiconductor package has a die 6, a die pad 2, a plurality of outer leads 1, and bonding wires 4 electrically connected to the outer leads 1, all sealed with seal members 3 formed with their top ends 3a and bottom ends 3b facing the die 6 and the die pad 2, respectively. The outer leads 1 has electric connecting faces 1a, 1b at the top and bottom ends 3a, 3b of the seal member 3, and is formed so as to be higher than the height of the top end 3a of the seal member 3. |
