| 摘要 |
PROBLEM TO BE SOLVED: To provide a package molded object for a light emitting device in which imperfect soldering in the case of packaging can be reduced, and a light emitting device. SOLUTION: This package molded object is provided with a recessed part 14 for accommodating a light emitting element chip, and a positive and a negative lead electrodes 21, 22. The electrodes are molded in an unified body by using resin, in such a manner that the electrodes are exposed on a bottom surface of the recessed part, bent in an end portion of a bonding surface, and exposed along the bonding surface. In the package molded body, a first protruding part 11 formed on the bonding surface, along the end surface of the positive electrode 21 exposed on the bonding surface, and a second protruding part 12 formed on the bonding surface, along the end surface of the negative electrode 22 exposed on the bonding surface are disposed. |
