| 摘要 |
PROBLEM TO BE SOLVED: To prevent cross talk effectively in an integral light sending/receiving circuit module. SOLUTION: A platform substrate 1 made of Si is covered with a thermally oxidized film 2, a grounded conductive layer 3 is formed in as wide a range as possible in its receiving side region, an insulating layer 4 is formed on the grounded conductive layer 3, and a wiring a5 is formed on the insulating layer 4. In a sending region, a wiring b8 is formed on the thermally oxidized film 2, and a wiring c10 is formed on an insulating layer 9. A light-receiving device 6, a light emitting device 11, LSs 17, 12 are mounted and the receiving side is covered with a box-shaped shielding conductive body 20, and the shielding body 20 is electrically connected to the grounded conductive layer 3. |
