BGA PACKAGE USING CONDUCTIVE BALLS HAVING MAGNETIC CORE

摘要

PURPOSE: A BGA(Ball Grid Array) package using conductive balls having magnetic core is provided to solve a problem of a PCB(Printed Circuit Board) design that a region where conductive balls are formed on a substrate of a BGA is restricted by improving a structure. CONSTITUTION: A BGA(Ball Grid Array) package(140) comprises a substrate(120), a molding resin(110) formed on one surface of the substrate(120) for enclosing a semiconductor chip mounted region, conductive balls(130), such as solder balls, formed on the other surface(122) of the substrate(120) with a lattice-type shape. At this time, bonding pads of the semiconductor chip are electrically connected with the substrate(120) using bonding wires as a connecting part and electrically connected with each conductive ball(130). At this point, the conductive balls(130) are equally formed on the surface(122) of the substrate(120) without a space on the edge portion of the substrate(120).