SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To reduce chip size by reducing chipping. SOLUTION: In a compound semiconductor substrate 11 in which a plurality of semiconductor elements 12 are formed, modified layers 17 in which crystallinity is collapsed by ion implantation or the like are formed on regions (dicing regions 14) between forming regions of the semiconductor elements 12. By dicing the compound semiconductor substrate 11 while passing the modified layers 17 (dicing regions 14), the semiconductor elements 12 are separated individually.