| 摘要 |
PROBLEM TO BE SOLVED: To provide a package for a semiconductor device, which enables a thermoelectric cooling device and a semiconductor device, both stored inside to work normally and stably for a long time. SOLUTION: The package for a semiconductor device comprises a base 1 having, on the upper principal plane, a mounting section 1a to mount the semiconductor device 10 via the thermoelectric cooling device 11, a frame body 3 so bonded on the peripheral part of the upper principal plane as to surround the mounting section 1a, input/output terminals 4 having a metallized interconnection layer 4a extended through the frame body 3 for electrically connecting the inside and the outside of the frame body 3, and a cover body 6 bonded on the top surface of the frame body 3. At the center of the upper principal plane of the base 1, an insulation substrate 15 is disposed which has an interconnection conductor 15a whose one end is connected to the thermoelectric cooling device 11 and the other end is electrically connected to the metallized interconnection layer 4a by a bar-like conductive member 15b. |
