| 摘要 |
PROBLEM TO BE SOLVED: To provide a package for a semiconductor device which allows a thermoelectric cooling device and a semiconductor device, both stored inside, to work normally and stably for a long time. SOLUTION: The package for a semiconductor device comprises a base 1 having on the upper principal plane a mounting section 1a to mount the semiconductor device 10 via the thermoelectric cooling device 11, a frame body 3 bonded on the peripheral part of the upper principal plane, input/output terminals 4 having a metallized interconnection layer 4a for electrically connecting the inside and the outside of the frame body 3, and a cover body 6 bonded on the top surface of the frame body 3. At the center of the upper principal plane of the base 1, an insulation base 15 is disposed which has an interconnection conductor 15a whose one end is connected to the thermoelectric cooling device 11 and the other end electrically connected to the metallized interconnection layer 4a by a bar-like conductive member 15b. The insulation base 15 has, on the top surface, a tilted face 15c which becomes gradually thicker from one end toward the other end of the interconnection conductor 15a. |
