LEAD-FREE GLASS, ELECTRONIC CIRCUIT BOARD COMPOSITION, AND THE ELECTRONIC CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To provide lead-free glass having low dielectric constant and low dielectric loss for production of electronic circuit boards by firing at 900 deg.C or less. SOLUTION: The lead-free glass comprises 45-60 mol% of SiO2, 0-10 mol% of B2O3, 5-18 mol% of Al2O3, 5-40 mol% of MgO, 7-40 mol% of CaO, 0-20 mol% of SrO+BaO, 0-10 mol% of ZnO, 0-5 mol% of TiO2+ZrO2, and 0-5 mol% of Li2O+Na2O+K2O.