| 摘要 |
PROBLEM TO BE SOLVED: To enable constitution of a semiconductor device having the same size as a chip size in order to satisfy a theme to be smaller and thinner for high density mounting, and provide a semiconductor device whose manufacturing cost can be reduced by improving manufacturing efficiency by reducing manufacturing process, and simultaneously by saving material cost by making material like resin for sealing unnecessary. SOLUTION: In this semiconductor device, electric continuity is made from a surface pattern 3 formed on a surface 2 of a semiconductor element 1 to the rear 6 of the element 1 via through holes 4, a rear pattern 8 connected with the through holes 4 is formed on the rear 6 of the element 1, and lands 9 as external terminals linked with the rear pattern 8 are formed. |
